DAN3000：DesignArt采用Tensilica处理器内核开发4G/LTE SoC

产品特性：
    *  采用40nm工艺制造
    *  可以提供1Gbps以上的移动宽带数据吞吐量
    *  集成了所有的RAN处理层
应用范围：
    *  4G/LTE应用

DesignArt Networks采用多个Tensilica定制处理器内核开发DAN3000系列4G/LTE SoC，该公司在家庭和城区LTE接入基站市场是一个领先的LTE SoC供应商。DAN3000系列4G SoC采用40nm工艺制造，可以提供1Gbps以上的移动宽带数据吞吐量，完全，满足LTE Advanced应用的需要。

DesignArt Networks在DAN3000系列SoC中集成了所有的RAN处理层，从而有效消除了运营商在提供几个Gbps 4G宽带服务时面临的成本、尺寸和性能障碍。

“Tensilica的可定制数据层处理器(DPU)内核为我们提供了开发高度集成的多层SoC架构的能力，使得我们可以实现市场上最高的每瓦MIPS，”DesignArt Networks CTO Assaf Touboul说，“Tensilica DPU内核的可定制能力使得我们可以设计出一种完全满足先进3G/4G信号处理性能需求的定制DSP架构。”

Without this capability it would not have been possible to develop such a powerful, yet efficient, multi-layer system-on-chip architecture."
"The DAN3000 SoC platform is a breakthrough device that provides equipment vendors with a future-proof, software-defined, integrated development platform," said Eric Dewannain, Tensilica's vice president and general manager of the baseband business unit. "This SoC design exemplifies what designers with deep knowledge of application-specific product requirements can achieve with our customizable dataplane processor IP cores."

The DAN3000 SoC platform can replace several FPGA, DSP and Network Processor components, and in some cases, even multiple baseband cards, with a single-chip SoC design. This eliminates multiple vendor-specific development frameworks, providing a single integrated development environment (IDE), while offering state-of-the art multi-core simulation and debugging tools, as well as a single structured C/C++ programming model. Moreover, as the first fully software-defined multi-layer, multi-core SoC architecture, the DAN3000 SoC family provides a single integrated development framework for all RAN product segments,  ranging from traditional BTS, BBU, RRH, and Mobile Backhaul equipment, to next-generation Compact BTS equipment.